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| Intel Core i7/i5 |
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CEM860
- Intel® Quad/Dual Core™ i7/i5 processor
- Intel® PCH QM67
- 2 DDR3-1.066/1.333 SODIMMs max. up to 16GB
- 22 lanes of PCIe gen 2 at 5GT/s
- 2 SATA-600 and 2 SATA-300
- 8 USB 2.0 ports
- 2 USB 3.0 ports (optional)
- TPM supported (optional)
- Dimensions: 125 x 95 mm
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| t.b.d. |
CEM860DG-i7-27150E |
COM Express Modul w/Intel Quad Core i7-2715QE 2.1GHz, USB 3.0 |
NEW |
| t.b.d. |
CEM860DG-i7-2610UE |
COM Express Modul w/Intel Core i7-2610UE 1.5GHz |
NEW |
| t.b.d. |
CEM860DG-i5-2515E |
COM Express Modul w/Intel Core i5-2515E 2.5GHz, USB 3.0 |
NEW |
| t.b.d. |
CEM860-DG-i3-2340UE |
COM Express Modul w/Intel Core i3-2340UE 1.3GHz |
NEW |
| t.b.d. |
CEM860DG-B81E |
COM Express Modul w/Intel Celeron B810E |
NEW |
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| Intel Core 2 Duo |
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CEM830
- Socket M Intel Core 2 Duo processor with FSB 533/667MHz
- Intel 945GME and ICH7M chipset
- With high performance integrated graphics controller and discrete solution through PCIe x16 interface
- 20 lanes of PCI Express
- 8x USB 2.0 ports
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2381 |
CEM830VE |
COM Express Module
w/ Socket M, 10/100Mbps |
- |
| t.b.d. |
CEM830VG |
COM Express Module
w/ Socket M, 10/100/1000Mbps |
- |
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CEM850
- Socket P Intel Core 2 Duo processor with FSB 667/800/1.066MHz
- Intel GM45 and ICH9M chipset
- With high performance integrated graphics controller and discrete solution through PCIe x16 interface
- 21 lanes of PCI Express
- 8x USB 2.0 ports
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| t.b.d. |
CEM850VG |
COM Express Module
w/Intel Core 2 Duo 667/800/1.066MHz |
- |
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COM Express Module 200
- Intel Socket M, supports Core 2 Duo/Core 2 Duo LV processor family
- Intel 945GME chipset
- One DDR2 SODIMM socket support un-buffered non-ECC DDR2 533/667 up to 2GB
- Supports 2x serial-ATA for high speed drivers, 8x USB 2.0 for fast peripherals
- Type 2 COM Express Module support up to 21 express lanes, 32bit PCI interface, one IDE and Gigabit LAN
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 80°C
- Relative humidity: 10% to 90%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2391 |
COM Express Module 200-SKT |
Intel Socket M, Core 2 Duo family processor |
- |
| PMSS2391-1 |
COM Express Module 200-T7400 |
w/Intel Core 2 Duo T7400 2.16GHz |
- |
| PMSS2391-2 |
COM Express Module 200-T2500 |
w/Intel Core Duo T2500 2.0GHz |
- |
| PMSS2391-3 |
COM Express Module 200-440 |
w/Intel Core Solo Celeron M 440 1.86GHz |
- |
| PMSS2393 |
COM Express Module 200-423 |
w/Intel Celeron M 1.06GHz |
- |
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COM Express Module 300
- Socket P Intel Core 2 Duo family processor
- Intel GME965 chipset
- 2x DDR2 DIMM socket support un-buffered non-ECC DDR2
- Type 2 COM Express Module support up to 21 express lanes, 32bit PCI interface, one IDE and Gigabit LAN
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 85°C
- Relative humidity: 10% to 90%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2392 |
COM Express Module 300-SKT |
Intel Socket P, Core 2 Duo family processors |
- |
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COM Express Module 267
- Intel 2nd generation Core Mobile processors
- Intel QM67/HM65 PCH
- 1x DDR3 SO-DIMM socket
- Type 2 COM Express Module support 6 express lanes, 32 bit PCI interface, one DIE and Gigabit LAN
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 85°C
- Relative humidity: 10% to 90%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2400 |
COM Express Module 267-SKT |
Type 2 COM Expres extended module
QM67 for advanced application |
- |
| PMSS2400-1 |
COM Express Module 267L-SKT |
Type 2 COM Expres extended module
HM65 for advanced application |
- |
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| Intel Atom |
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COM Express Module 251
- Intel Atom N450 1.66GHz processor
- Intel ICH8M chipset
- Support DDR2 667 SODIMM up to 2GB
- Intel PCI Expres GbE 82574L
- Supports 3x SATA, 1x IDE, 8x USB 2.0 for fast peripherals
- Micro COM Express Type II supports up to 5 express lanes, 32bit PCI interface, one IDE and Gigabit LAN
- Dimensions: 95 x 95 mm (W x L)
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 85°C
- Relative humidity: 10% to 97%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2394 |
COM Express Module 251 |
w/Intel Atom N450 1.66GHz |
- |
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COM Express Module 252
- Intel Atom Dual Core D510 1.66GHz processor
- Intel ICH8M chipset
- Support DDR2 667 and 800 SODIMM up to 2GB
- Intel PCI Expres GbE 82574L
- Supports 3x SATA, 1x IDE, 8x USB 2.0 for fast peripherals
- Micro COM Express Type II supports up to 5 express lanes, 32bit PCI interface, one IDE and Gigabit LAN
- Dimensions: 95 x 95 mm (W x L)
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 85°C
- Relative humidity: 10% to 97%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2395 |
COM Express Module 252 |
w/Intel Atom Dual Core D510 1.66GHz |
- |
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CEM831
- Intel Atom processor N270 1.6GHz with FSB 533MHz
- Intel 945GME and ICH7M chipset
- 2x DDR2 SODIMM up to 4GB
- 19 lanes for PCIe
- 8x USB 2.0 ports
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| t.b.d. |
CEM831VG-N270 |
COM Express Module
w/Intel Atom N270 1.6GHz |
- |
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COM Express Module 270
- Intel Atom N270 1.6GHz processor
- Intel 945GSE chipset
- Support DDR2 400/533 SODIMM up to 2GB
- Realtek RTL8111C Gbe LAN controller
- Supports 2x SATA, 8x USB 2.0 for fast peripherals
- COM Express Basic Type II Module supports up to 5 express lanes, 32bit PCI interface, one IDE and Gigabit LAN
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 85°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2397 |
COM Express Module 270 |
w/Intel Atom N270 1.6GHz |
- |
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COM Express Module 210
- Intel Atom Z530/510 processor
- US15W SCH, 400/533FSB
- H/W acceleration of video decode
- DDR2 400/533 SODIMM
- 10/100/1.000Mbps Ethernet controller
- LVDS/SVDO interface
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 80°C
- Relative humidity: 10% to 90%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2396 |
COM Express Module 210-A16 |
w/Intel Atom Z530 1.6GHz |
- |
| PMSS2396-1 |
COM Express Module 210-A11 |
w/Intel Atom Z510 1.1GHz |
- |
|
COM Express Module 251X
- Intel Atom N450 1.66GHz processor
- Low power COM Express CPU module
- Intel ICH8M chipset
- Supports DDR2 667 SO-DIMM up to 2GB
- Intel PCI express Gbe 82574L
- Supports 3x SATA, 1x DIE, 8x USB 2.0 for fast peripherals
- Micro COM express type II supports up to 5 express lanes, 32 bit PCI interface and one IDE and Gigabit LAN
- Operating temperature: -40°C to 85°C
- Storage temperature: -40°C to 85°C
- Relative humidity: 10% to 97%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2398 |
COM Express Module 251X |
w/Intel Atom N450 1.66GHz, -40°C to 85°C |
- |
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COM Express Module 253
- Intel Atom Dual Core D525 1.8GHz processor
- Intel ICH8M chipset
- Lower power COM Express CPU module
- Support DDR2 667 and 800 SO-DIMM up to 2GB
- Intel PCI express GbE 82574L
- Supports 3x SATA, 1x DIE, 8x USB 2.0 for fast peripherals
- Micro COM Express Type II supports up to 5 express lanes, 32 bit PCI interface and one IDE and Gigabit LAN
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 85°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2399 |
COM Express Module 253 |
Intel Atom D525 1.8GHz |
- |
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| Intel Pentium M/Celeron M |
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CEM820
- Intel Pentium M/Celeron M processor
- Intel 915GME/910GMLE and ICH6M chipset
- DDR2 400/533 up to 2GB
- With high performance integrated graphics controller and discrete solution through PCIe x16 interface
- 19 lanes for PCIe
- 8x USB 2.0 ports
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2380 |
CEM820VG |
COM Express Module
w/Socket 478 |
- |
| t.b.d. |
CEM820VG-1GE |
COM Express Module
w/ULV Intel Celeron M 1GHz |
- |
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| AMD G-Serie APU |
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CEM100
- AMD G-Series APU T56N 1.65GHz/T40R 1.0GHz
- AMD A55E FCH
- 2 DDR3-1.066 SO-DIMMs max. up to 8GB
- 8 lanes of PCIe gen 2 at 5GT/s
- 4 SATA-600 with Raid 0, 1, 5, 10
- DirectX11, OpenGL 4.0 and OpenCL 1.0 supported
- TPM supported
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| t.b.d. |
CEM100-T56N |
COM Express Modul, w/AMD T56N 1.6GHz |
- |
| t.b.d. |
CEM100-T40R |
COM Express Modul, w/AMD T40R 1GHz |
- |
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| COM Express Development Baseboard |
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CEB94000
- Standard ATX form factor for development purpose
- 1x PCIe x16, 1x PCIe x4, 3 PCIe x1 and 2 PCI slots
- 1x Expres Card, 1x PCI Express Mini Card and 1x Mini PCI
- Dimensions: 305 x 244 mm (W x L)
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2370 |
CEB94000VEA |
COM Express development baseboard |
- |
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CEB94006
- COM Express type 6 baseboard for evaluation purpose
- USB 3.0 supported
- Port 80 display for debugging
- Switch button for PWRBTN, RESET, SLEEP, LID
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| t.b.d. |
CEB94006HDGA |
COM Express evaluation baseboard |
- |
