• Socket M Intel Core 2 Duo processor with FSB 533/667MHz
• Intel 945GME and ICH7M chipset
• With high performance integrated graphics controller and discrete solution through PCIe x16 interface
• 20 lanes of PCI Express
• 8x USB 2.0 ports
• Dimensions: 95 x 125 mm (W x L)
• Operating temperature: 0°C to 60°C
• Relative humidity: 10% to 95%, non-condensing

Datenblatt CEM830

Optionen siehe Datenblatt

• Socket P Intel Core 2 Duo processor with FSB 667/800/1.066MHz
• Intel GM45 and ICH9M chipset
• With high performance integrated graphics controller and discrete solution through PCIe x16 interface
• 21 lanes of PCI Express
• 8x USB 2.0 ports
• Dimensions: 95 x 125 mm (W x L)
• Operating temperature: 0°C to 60°C
• Relative humidity: 10% to 95%, non-condensing

Datenblatt CEM850

Optionen siehe Datenblatt

• Socket M Intel Core 2 Duo/Core 2 Duo LV processor family
• Intel 945GME chipset
• One DDR2 SODIMM socket support un-buffered non-ECC DDR2 533/667 up to 2GB
• Supports 2x serial-ATA for high speed drivers, 8x USB 2.0 for fast peripherals
• Type 2 COM Express Module support up to 21 express lanes, 32bit PCI interface, one IDE and Gigabit LAN
• Dimensions: 95 x 125 mm (W x L)
• Operating temperature: 0°C to 60°C
• Storage temperature: -20°C to 80°C
• Relative humidity: 10% to 90%, non-condensing

Datenblatt COM Express Module 200

• Socket P Intel Core 2 Duo family processor
• Intel GME965 chipset
• 2x DDR2 DIMM socket support un-buffered non-ECC DDR2
• Type 2 COM Express Module support up to 21 express lanes, 32bit PCI interface, one IDE and Gigabit LAN
• Dimensions: 95 x 125 mm (W x L)
• Operating temperature: 0°C to 60°C
• Storage temperature: -20°C to 85°C
• Relative humidity: 10% to 90%, non-condensing

Datenblatt COM Express Module 300

• Intel Atom N450 1.66GHz processor
• Intel ICH8M chipset
• Support DDR2 667 SODIMM up to 2GB
• Intel PCI Expres GbE 82574L
• Supports 3x SATA, 1x IDE, 8x USB 2.0 for fast peripherals
• Micro COM Express Type II supports up to 5 express lanes, 32bit PCI interface, one IDE and Gigabit LAN
• Dimensions: 95 x 95 mm (W x L)
• Operating temperature: 0°C to 60°C
• Storage temperature: -20°C to 85°C
• Relative humidity: 10% to 97%, non-condensing

Datenblatt COM Express Module 251

• Intel Atom Dual Core D510 1.66GHz processor
• Intel ICH8M chipset
• Support DDR2 667 and 800 SODIMM up to 2GB
• Intel PCI Expres GbE 82574L
• Supports 3x SATA, 1x IDE, 8x USB 2.0 for fast peripherals
• Micro COM Express Type II supports up to 5 express lanes, 32bit PCI interface, one IDE and Gigabit LAN
• Dimensions: 95 x 95 mm (W x L)
• Operating temperature: 0°C to 60°C
• Storage temperature: -20°C to 85°C
• Relative humidity: 10% to 97%, non-condensing

Datenblatt COM Express Module 252

• Intel Atom processor N270 1.6GHz with FSB 533MHz
• Intel 945GME and ICH7M chipset
• 2x DDR2 SODIMM up to 4GB
• 19 lanes for PCIe
• 8x USB 2.0 ports
• Dimensions: 95 x 125 mm (W x L)
• Operating temperature: 0°C to 60°C
• Relative humidity: 10% to 95%, non-condensing

Datenblatt CEM831

Optionen siehe Datenblatt

• Intel Atom N270 1.6GHz processor
• Intel 945GSE chipset
• Support DDR2 400/533 SODIMM up to 2GB
• Realtek RTL8111C Gbe LAN controller
• Supports 2x SATA, 8x USB 2.0 for fast peripherals
• COM Express Basic Type II Module supports up to 5 express lanes, 32bit PCI interface, one IDE and Gigabit LAN
• Dimensions: 95 x 125 mm (W x L)
• Operating temperature: 0°C to 60°C
• Storage temperature: -20°C to 85°C
• Relative humidity: 10% to 95%, non-condensing

Datenblatt COM Express Module 270

• Intel Atom Z530/510 processor
• US15W SCH, 400/533FSB
• H/W acceleration of video decode
• DDR2 400/533 SODIMM
• 10/100/1.000Mbps Ethernet controller
• LVDS/SVDO interface
• Dimensions: 95 x 125 mm (W x L)
• Operating temperature: 0°C to 60°C
• Storage temperature: -20°C to 80°C
• Relative humidity: 10% to 90%, non-condensing

Datenblatt COM Express Module 210

• Intel Pentium M/Celeron M processor
• Intel 915GME/910GMLE and ICH6M chipset
• DDR2 400/533 up to 2GB
• With high performance integrated graphics controller and discrete solution through PCIe x16 interface
• 19 lanes for PCIe
• 8x USB 2.0 ports
• Dimensions: 95 x 125 mm (W x L)
• Operating temperature: 0°C to 60°C
• Relative humidity: 10% to 95%, non-condensing

Datenblatt CEM820

Optionen siehe Datenblatt

Optionen siehe Datenblatt

• Standard ATX form factor for development purpose
• 1x PCIe x16, 1x PCIe x4, 3 PCIe x1 and 2 PCI slots
• 1x Expres Card, 1x PCI Express Mini Card and 1x Mini PCI
• Dimensions: 305 x 244 mm (W x L)
• Operating temperature: 0°C to 60°C
• Relative humidity: 10% to 95%, non-condensing

Datenblatt CEB94000

Optionen siehe Datenblatt