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| Intel Core i7/i5 |
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COM Express Module 267
- Intel® 2nd Generation Core Mobile Processors
- Intel® QM67/HM65 PCH
- 1x DDR3 SO-DIMM Socket
- Type 2 COM Express Module Support 6 Express Lanes, 32 bit PCI Interface, One IDE and Gigabit LAN
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 80°C
- Relative humidity: 10% to 90%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2400 |
COM Express Module 267-SKT |
2nd Intel Core Mobile processor, 3x SATA, PCIe x16 |
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COM Express Module 267S
- Intel® 2nd generation Core processor family
- Intel® QM67 PCH chipset
- 1x DDR3 SO-DIMM socket support non-ECC DDR3 800/1.066/1.333MHz up to 8GB
- Support SDVO
- Type 2 COM Express 2.0 Module support 6 Express Lanes, 32 bit PCI interface, one IDE and Gigabit LAN
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 80°C
- Relative humidity: 10% to 90%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2402 |
COM Express Module 267S-SKT |
2nd Intel Core processor, 3x SATA, PCI, SDVO |
NEW |
| PMSS2402-1 |
COM Express Module 267S-i5-2515E |
Intel Core i5-2515E 2.5GHz, 3x SATA, PCI, SDVO |
NEW |
| PMSS2402-2 |
COM Express Module 267S-i7-2610UE |
Intel Core i7-2610UE 1.5GHz, 3x SATA, PCI, SDVO |
NEW |
| PMSS2402-3 |
COM Express Module 267S-i7-2715QE |
Intel Core i7-2715QE 2.1GHz, 3x SATA, PCI, SDVO |
NEW |
| PMSS2402-4 |
COM Express Module 267S-Celeron-B810E |
Intel Celeron B810E 1.6GHz, 3x SATA, PCI, SDVO |
NEW |
| PMSS2402-5 |
COM Express Module 267S-Evaluation Board |
Evaluation Board, 3x SATA, PCI, SDVO |
NEW |
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CEM860
- Onboard Intel® Quad/Dual Core i7/i5/i3/Celeron processors
- Intel® PCH QM67
- 2 DDR3-1.066/1.333 SODIMMs max. up to 16GB
- 3DDI, 1x VGA, 1x LVDS
- 22 lanes of PCIe gen 2 at 5GT/s
- 2 SATA-600 and 2 SATA-300
- 8 USB 2.0 ports
- 2 USB 3.0 ports (optional)
- TPM supported (optional)
- Dimensions: 125 x 95 mm
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| t.b.d. |
CEM860DG-i7-27150E |
COM Express Modul w/Intel Quad Core i7-2715QE 2.1GHz, USB 3.0 |
NEW |
| t.b.d. |
CEM860DG-i7-2610UE |
COM Express Modul w/Intel Core i7-2610UE 1.5GHz |
NEW |
| t.b.d. |
CEM860DG-i5-2515E |
COM Express Modul w/Intel Core i5-2515E 2.5GHz, USB 3.0 |
NEW |
| t.b.d. |
CEM860-DG-i3-2340UE |
COM Express Modul w/Intel Core i3-2340UE 1.3GHz |
NEW |
| t.b.d. |
CEM860DG-B81E |
COM Express Modul w/Intel Celeron B810E |
NEW |
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| Intel Core 2 Duo |
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CEM830
- Socket M Intel® Core 2 Duo/Core Duo/Core Solo processor with FSB 533/667MHz
- Intel 945GME and ICH7M chipset
- With high performance integrated graphics controller and discrete solution through PCIe x16 interface
- 20 lanes of PCI Express
- 8x USB 2.0 ports
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2381 |
CEM830VE |
COM Express Module
w/ Socket M, 10/100Mbps |
- |
| t.b.d. |
CEM830VG |
COM Express Module
w/ Socket M, 10/100/1000Mbps |
- |
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CEM850
- Socket P Intel® Core 2 Duo/Celeron M processor with FSB 667/800/1.066MHz
- Intel® GM45 and ICH9M chipset
- With high performance integrated graphics controller and discrete solution through PCIe x16 interface
- 21 lanes of PCI Express
- 8x USB 2.0 ports
- ITP port supported
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| t.b.d. |
CEM850VG |
COM Express Module
w/Intel Core 2 Duo 667/800/1.066MHz |
- |
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COM Express Module 200
- Intel® Socket M, supports Core 2 Duo/Core 2 Duo LV processor family
- Intel® 945GME chipsets
- One DDR2 SO-DIMM socket support un-buffered non-ECC DDR2 533/667 up to 2GB
- Supports 2x serial ATA for high speed drivers, 8x USB 2.0 for fast peripherals
- Type 2 COM Express Module support up to 21 Express lanes, 32 bit PCI interface, one IDE and Gigabit LAN
- Dimensions: COM Express Module/95 x 125 mm
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 80°C
- Relative humidity: 10% to 90%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2391 |
COM Express Module 200-SKT, 2x SATA, 5x PCIe x1 |
Socket M Intel Core 2 Duo/Solo/Celeron processor |
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| PMSS2391-1 |
COM Express Module 200-T7400 |
Intel Core 2 Duo T7400 2.16GHz,2x SATA,5x PCIe x1 |
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| PMSS2391-2 |
COM Express Module 200-T2500 |
Intel Core Duo T2500 2.0GHz, 2x SATA, 5x PCIe x1 |
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| PMSS2391-3 |
COM Express Module 200-440 |
Intel Core Solo C M440 1.86GHz,2x SATA,5x PCIe x1 |
- |
| PMSS2393 |
COM Express Module 200-423 |
Intel Celeron M 423 1.06GHz, 2x SATA, 5x PCIe x1 |
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| Intel Atom |
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COM Express Module 254
- Intel® Atom Dual Core processor D2700, 2.13GHz
- Intel® ICH10R to support Intel® Matrix Storage RAID 0/1/5/10
- 1x DDR3 SO-DIMM socket up to 4GB
- Type 2 COM Express compact size to support 5 Express lanes, 32 bit PCI interface, one IDE, Gigabit LAN and HDMI
- Dimensions: 95 x 95 mm (W x L)
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 80°C
- Relative humidity: 10% to 90%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2401 |
COM Express Module 254 |
Intel Atom D2700 2.13GHz, 4x SATA, 5x PCIe x1 |
NEW |
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COM Express Module 251
- Low Power COM Express CPU Module
- On-board Intel® Atom N450 1.66GHz processor
- Intel® ICH8M Chipset
- Support DDR2 667 SO-DIMM up to 2GB
- Intel® PCI Express GbE 82574L
- Support 3x SATA, 1x IDE, 8x USB 2.0 for fast peripherals
- Micro COM Exrpress Type II supports up to 5 Express lanes, 32 bit PCI interface and one IDE and Gigabit LAN
- Dimensions: 95 x 95 mm
- Operating temperature: -20°C to 60°C
- Storage temperature: -20°C to 85°C
- Relative humidity: 10% to 97%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2394 |
COM Express Module 251, -20°C to 60°C |
Intel Atom N450 1.66GHz, 3x SATA, 1x PCIe x4/x1 |
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CEM831
- Intel® Atom processor N270 1.6GHz with FSB 533MHz
- Intel® 945GME and ICH7M chipset
- With high performance integrated graphics controller and discrete solution through PCI Expresss x16 interface
- 2x DDR2 SODIMM up to 4GB
- 19 lanes for PCIe x1
- 8x USB 2.0 ports
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| t.b.d. |
CEM831VG-N270 |
COM Express Module
w/Intel Atom N270 1.6GHz |
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COM Express Module 270
- Low Power COM Express CPU Module
- On-board Intel® Atom N270 1.6GHz processor
- Intel® 945GSE chipset
- Support DDR2 400/533 SO-DIMM up to 2GB
- Realtek RTL8111C Gbe LAN controller
- Support 2x SATA, 8x USB for fast peripherals
- COM Express Basic Type II Module supports up to 5 Express lanes, 32 bit PCI interface and one IDE and Gigabit LAN
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Storage temperature: -20°C to 80°C
- Relative humidity: 10% to 90%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2397 |
COM Express Module 270 |
Intel Atom N270 1.6GHz, 2x SATA, 1x PCIe x4/x1 |
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COM Express Module 251X
- Support wide range operating temperature
- Low power COM Express CPU module
- On-board Intel® Atom N450 1.66GHz processor
- Intel® ICH8M chipset
- Support DDR2 667 SO-DIMM up to 2GB
- Intel® PCI Express GbE 82574L
- Support 3x SATA, 1x IDE, 8x USB2.0 for fast peripherals
- Micro COM Express Type II Supports up to 5 Express Lanes,32 bit PCI Interface and One IDE and Gigabit LAN
- Dimensions: 95 x 95 mm (W x L)
- Operating temperature: -40°C to 85°C
- Storage temperature: -40°C to 85°C
- Relative humidity: 10% to 97%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2398 |
COM Express Module 251X, -40°C to 85°C |
Intel Atom N450 1.66GHz, 3x SATA, 1x PCIe x4/x1 |
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COM Express Module 253
- Low Power COM Express CPU Module
- Onboard Intel® Atom Dual Core D525 1.8GHz processor
- Intel® ICH8M chipset
- Support DDR2 667 and 800 SO-DIMM up to 2GB
- Intel® PCI Express GbE 82574L
- Support 3x SATA, 1x IDE, 8x USB2.0 for fast peripherals
- Micro COM Express Type II supports up to 5 Express lanes, 32 bit PCI interface and one IDE and Gigabit LAN
- Dimensions: 95 x 95 mm (W x L)
- Operating temperature: -20°C to 60°C
- Storage temperature: -20°C to 85°C
- Relative humidity: 10% to 97%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2399 |
COM Express Module 253 |
Intel Atom Dual Core D525 1.8GHz,3x SATA,1x PCIe x |
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| Intel Pentium M/Celeron M |
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CEM820
- Socket 478 Intel® Pentium® M/Celeron® M processor with 400/533MHz
- Intel® 915GME/910GMLE and ICH6M chipset
- DDR2 400/533 up to 2GB
- With high performance integrated graphics controller and discrete solution through PCIe x16 interface
- 19 lanes for PCIe
- 8x USB 2.0 ports
- Dimensions: 95 x 125 mm (W x L)
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2380 |
CEM820VG |
COM Express Module
w/Socket 478 |
- |
| t.b.d. |
CEM820VG-1GE |
COM Express Module
w/ULV Intel Celeron M 1GHz |
- |
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| AMD G-Serie APU |
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CEM100
- Onboard AMD dual core T56N 1.65GHz, T40E 1.0GHz and single core T40R 1.0GHz G-Series processors
- AMD A55E FCH
- 2 DDR3-1.066 SO-DIMMs max. up to 8GB
- 2 DDI (2 DP either 1x LVDS, 1x DP), 1x VGA
- 22 lanes of PCIe gen 2 at 5GT/s
- 4 SATA-600 with Raid 0, 1, 5, 10
- 8x USB 2x0
- DirectX11, OpenGL 4.0 and OpenCL 1.0 supported
- TPM supported (optional)
- Dimensions: 125 x 95 mm
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| t.b.d. |
CEM100-T56N |
COM Express Modul, w/AMD T56N 1.6GHz |
- |
| t.b.d. |
CEM100-T40R |
COM Express Modul, w/AMD T40R 1GHz |
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| COM Express Development Baseboard |
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CEB94000
- Standard ATX form factor for development purpose
- 1x PCIe x16, 1x PCIe x4, 3 PCIe x1 and 2 PCI slots
- 1x Expres Card, 1x PCI Express Mini Card and 1x Mini PCI
- Dimensions: 305 x 244 mm (W x L)
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| PMSS2370 |
CEB94000VEA |
COM Express development baseboard |
- |
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CEB94006
- COM Express development baseboard for type 6 basic and compact size for evaluation purpose
- PCIe x16, 2x PCIe x1 and PCIe x4 expansion
- ExpressCard and Mini Card
- Super speed USB 3.0
- SATA-600
- Port 80 display for debugging
- Switch button for PWRBTN, RESET, SLEEP, LID
- Dimensions: 244 x 291 mm
- Operating temperature: 0°C to 60°C
- Relative humidity: 10% to 95%, non-condensing
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| Artikel |
Bezeichnung 1 |
Bezeichnung 2 |
Beschreibung |
| t.b.d. |
CEB94006HDGA |
COM Express evaluation baseboard |
- |
